Tflex B200 - three options
Thermal Conductivity 2,0W/mK, Hardness (Shore 00) 42.00, Grey
Tflex B200 is a reliable, compliant thermal interface material offering good thermal performance and easy handling and features a range of multiple surface and re-enforcement options for a variety of applications. This gap filler's low modulus and softness relieves mechanical stress.
Tflex B200 helps absorb shock, resulting in improved device reliability over the long term. It has high dielectric insulation which works to protect against dielectric breakdown in or between devices. Tflex B200 as a standard product is naturally tacky on both sides and requires no additional adhesive coating that would inhibit thermal performance.
Tflex B200MFG, an option with a fiberglass layer in the middle, has high tensile strength maintaining the natural tack properties on both sides. This helps prevent deforming during manual or automated assembly.
Tflex B200FG, an option with a fiberglass layer re-enforcement on one side. This option will have better deflection than the B200MFG option, and provides protection close to one side.