Tflex 700

Thermal Conductivity 5,0W/mK,Harness 66, Dark Grey -40°C ~200°C

Silicone based Thermal Gap Filler
Product Description
Tflex 700 is a 5 W/mK soft gap filler thermal interface material with great thermal performance and high compliancy. The soft interface pad conforms to component topography, resulting in little or no stress on the components and mating chassis or parts.

Unique silicone and ceramic filler technology allows a combination of high compliancy and high thermal performance. Tflex 700 is stable from -45ºC thru 200ºC and meets UL 94V0 flame rating. Naturally tacky, it requires no additional adhesive coating which inhibits thermal performance.

E-shop:

https://www.atd-shop.com/qx713432/tflex-700-50w-mk-hardness-_shore-00_-70