Gap Fillers
Thermal Conductivity 1,2~34 W/mK
25 Products, different thicknesses 0,1~8,0mm
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Tflex P300 - Plus T-gard + soft
Thermal Conductivity 3,0W/mK, Hardness (Shore 00) 30.00, Purple Polyimide lined Gap Filler Laird Tflex® P300 is a soft and compliant gap filler with an integrated polyimide line...
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Tflex SF10 -10W/mK
Thermal Conductivity 10,20W/mK, Hardness (Shore 00) 41.00, Grey Silicone Free Thermal Gap Filler Product Description Tflex SF10 is an innovative high performing thermal material i...
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Tflex SF600 - Silicone Free
Thermal Conductivity 3,0W/mK, Hardness (Shore00) 80, Rose Compliant Silicone-Free 3.0 W/mK thermally conductive Gap FillerTflex SF600 is a high performance silicone-free thermal...
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Tflex SF800 - Silicone Free -7,8W/mK
Thermal Conductivity 7,8W/mK, Hardness (Shore 00) 81.00, Grey Tflex SF800 is a high-performance, compliant, silicone free thermal interface material. By coupling extremely high...
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Tflex UT20000 - Ultra-Thin
Thermal Conductivity 3,0 W/mK, Hardness (Shore 00) 56, Grey Ultra-Thin Thermal Gap Filler Ultra-thin gap filler offering great thermal performance and handling. Tflex UT20000 is...
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TflexHD300TG - Tgard, low pressure
Thermal Conductivity 2,7W/mK, Hardness (Shore 00) 38.00, Tan Laird Tflex™ HD300TG is a 2.7 W/mK gap filler material in Laird's high deflection line of products. Tflex HD300TG is...
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Tgon 800 - Conductive Interface Pad
Thermal Conductivity 5,0W/mK, Hardness (Shore 00) 85.00, Pewder Electrically Condutive Graphite Gap Filler Used where electrical isolation is not required, Tgon 800 is ideal for ...
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Tpli 200 - High thermal performance
Thermal Conductivity 6,0W/mK, Hardness (Shore 00) 70.00, Varies Tpli 200 is an Exceptionally Soft, Highly Compressible Gap Filler premium gap filler. Tpli 200's exceptional com...
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Ttape 1000- Thermally Conuctive Adhesive Tape
Thermal Conductivity 0,7W/mK, Density 1.24 g/cc, WhiteTtape™ 1000A - Thermally Conductive Adhesive Tape Product Description TtapeTM 1000A is a stand-alone pressure sensitive adh...
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